Wettable carrier in gas drying system for wafers
AssigneeRCA Corporation
InventorAlfred Mayer
Life of this patent
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Abstract
A gas drying system for use in removing a liquid from a substrate comprises a carrier adapted to support the substrate wherein the parts of the carrier that make contact with the substrate have a surface wettable by the liquid and the wettable surface has a roughened surface of a material that is capable of being hydroxylated, and a dryer for exposing the substrate to a stream of ambient-temperature gas.
Claims20
In a wafer carrier adapted to support a semiconductor substrate while being exposed to a liquid during processing, the improvement in said carrier comprising the parts thereof that make contact with said substrate having a surface wettable by said liquid and said wettable surface having a roughened surface of a material that is capable of being hydroxylated.
In a method of processing a semiconductor substrate including the steps of cleaning said substrate in a cleaning solution while being supported in a wafer carrier and drying said substrate after removal from said cleaning solution, the improvement in said method comprising performing said drying step in the same wafer carrier utilized during said cleaning step, wherein the parts of said carrier that make contact with said substrate have a surface wettable by said cleaning solution and said wettable surface comprises a roughened surface of a material that is capable of being hydroxylated.
A gas drying system for use in removing a liquid from a substrate comprising:
- a carrier adapted to support said substrate wherein the parts of said carrier that make contact with said substrate have a surface wettable by said liquid said wettable surface comprises a roughened surface of a material that is capable of being hydroxylated, and
- means for exposing said substrate, while supported in said carrier, to a stream of ambient-temperature gas.
Dependencies are inferred from the claim text.