Wafer carrier

A moldable plastic, distortion and warp resistant wafer carrier to be made in a mold having an open top for insertion and removal of wafers, an open bottom, a pair of opposed upright end walls, one said upright end wall being H-shaped with a horizontal indexing bar extending thereacross intermediate the height of the carrier, a pair of opposed upright side walls, with inner, opposed ribs for spacing axially aligned wafers in the carrier, the other upright end wall comprised of a center panel and two side panels each oriented at an oblique angle relative to the center panel, the center panel having a planar outer surface with an upright center line and two planar inner surfaces being oriented obliquely to each other at the center line so that the center panel is thinner adjacent the center line than at outer edge portions of the center panel thereby adding rigidity to the wafer carrier while minimizing warp stress in the wafer carrier and preventing the other upright end wall from distorting or bowing inwardly when the wafer carrier is subjected to high temperatures or caustic chemicals and further having a transverse outwardly extending upper flange on each sidewall extending along the length thereof, each flange having at least two anti-warp indentations one each adjacent said upper flange's respective ends to permit the mold to hold the wafer carrier in its originally molded shape as the wafer carrier cools in the mold thereby minimizing warp when the wafer carrier is cooling and solidifying within the mold.