Y10S 156/932
With poking during delaminating
Official title: with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
Y10S156/932 (With poking during delaminating) appears on 36 US grants and 33 published applications in this corpus.
Search patents in Y10S- Granted patents
- 36
- Published applications
- 33
- Assignees
- 28
- Inventors
- 75
- Latest grant
- 19 Sep 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 2 |
| 2007 | 2 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 3 |
| 2011 | 0 | 4 |
| 2012 | 6 | 2 |
| 2013 | 2 | 6 |
| 2014 | 4 | 4 |
| 2015 | 3 | 2 |
| 2016 | 7 | 0 |
| 2017 | 0 | 1 |
| 2018 | 1 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 2 |
| 2021 | 1 | 1 |
| 2022 | 2 | 1 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Detaching a die from an adhesive tape by air ejection19 Sep 2023US 11,764,098 B2Asmpt Singapore Pte. Ltd.
- Apparatus for separating a window and method for separating a window using the same4 Oct 2022US 11,458,721 B2Samsung Display Co., Ltd.
- Chip ejecting apparatus1 Feb 2022US 11,239,104 B2Samsung Electronics Co., Ltd.
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device13 Jul 2021US 11,062,925 B2Mitsubishi Electric Corporation
- Apparatus for separating a window and method for separating a window using the same17 Nov 2020US 10,836,151 B2Samsung Display Co., Ltd.
- Detaching a die from an adhesive tape by air ejection20 Oct 2022US 2022/0336254 A1Asm Technology Singapore Pte Ltd
- Apparatus for separating a window and method for separating a window using the same11 Mar 2021US 2021/0070030 A1Samsung Display Co., Ltd.
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device19 Nov 2020US 2020/0365430 A1Mitsubishi Electric Corporation
- Chip ejecting apparatus17 Sep 2020US 2020/0294839 A1Samsung Electronics Co., Ltd.
- Apparatus for separating a window and method for separating a window using the same11 Jul 2019US 2019/0210351 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Process for disengaging semiconductor die from an adhesive film89US 6,889,427 B2Freescale Semiconductor, Inc. · 2005
- Semiconductor chip-supply method and apparatus66US 5,589,029 AMatsushita Electric Industrial Co., Ltd. · 1996
- Method and apparatus for picking up work piece and mounting machine59US 7,445,688 B2TDK Corporation · 2008
- Method and apparatus for removal of semiconductor chips from hybrid circuits41US 3,969,813 ABell Telephone Laboratories, Incorporated · 1976
- Apparatus for temporary wafer bonding and debonding19US 8,181,688 B2Suss Microtec Lithography GmbH · 2012