Chip ejecting apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsJAE RYOUNG LEE, SANG HWAN KIM, MIN SUNG KIM
Life of this patent
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Abstract
A chip ejecting apparatus includes a table configured to be provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape, an ejector unit including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape, and a control unit configured to separately control on/off operations of the plurality of gas holes and select an active gas hole group from the plurality of gas holes. The active gas hole group is selected to overlap the target chip, and is configured to inject the gas toward the dicing tape along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip.
Claims21
A chip ejecting apparatus comprising:
- a table provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape;
- an ejector including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape;
- and
- a controller configured to separately control on/off operations of the plurality of gas holes and select an active gas hole group from the plurality of gas holes,
- wherein the active gas hole group is selected to overlap the target chip, and is configured to inject the gas toward the dicing tape along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip.
A chip ejecting apparatus comprising:
- a table provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape;
- an ejector configured to separate the target chip from the dicing tape;
- and
- a picker configured to pick up the separated target chip;
- wherein the ejector comprises a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape and an eject pin configured to project in a direction crossing a direction parallel to the lower surface of the dicing tape,
- the plurality of gas holes are configured to perform a sweeping operation in which the gas is injected toward the target chip along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip, and
- the eject pin is configured to extend toward the target chip and to provide the target chip to the picker after the sweeping operation.
A chip ejecting apparatus comprising:
- a table provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape;
- an ejector including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape;
- and
- a controller configured to separately control on/off operations of the plurality of gas holes and to select an active gas hole group from the plurality of gas holes,
- wherein the active gas hole group is selected to overlap the target chip, and comprises a first gas hole group adjacent to a first edge of the target chip and a second active gas hole group adjacent to a central portion of the target chip, and
- the controller is configured to perform an on operation of the second gas hole group after performing an on operation of the first gas hole group.
-22. (canceled)
Dependencies are inferred from the claim text.