Y10S 156/93
Semiconductive product delaminating
Official title: Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
Y10S156/93 (Semiconductive product delaminating) appears on 225 US grants and 161 published applications in this corpus.
Search patents in Y10S- Granted patents
- 225
- Published applications
- 161
- Assignees
- 105
- Inventors
- 378
- Latest grant
- 19 Sep 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 13 | 0 |
| 2001 | 10 | 4 |
| 2002 | 4 | 8 |
| 2003 | 11 | 3 |
| 2004 | 3 | 2 |
| 2005 | 3 | 6 |
| 2006 | 1 | 6 |
| 2007 | 6 | 4 |
| 2008 | 4 | 4 |
| 2009 | 1 | 3 |
| 2010 | 6 | 9 |
| 2011 | 6 | 11 |
| 2012 | 9 | 7 |
| 2013 | 2 | 16 |
| 2014 | 12 | 10 |
| 2015 | 18 | 14 |
| 2016 | 9 | 10 |
| 2017 | 11 | 11 |
| 2018 | 15 | 9 |
| 2019 | 18 | 14 |
| 2020 | 7 | 7 |
| 2021 | 7 | 2 |
| 2022 | 6 | 1 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Detaching a die from an adhesive tape by air ejection19 Sep 2023US 11,764,098 B2Asmpt Singapore Pte. Ltd.
- Apparatus for separating a window and method for separating a window using the same4 Oct 2022US 11,458,721 B2Samsung Display Co., Ltd.
- Method and apparatus for transferring micro device, and electronic product using the same16 Aug 2022US 11,417,546 B2Korea Institute of Machinery & Materials
- Composition for forming a coating film for removing foreign matters3 May 2022US 11,319,514 B2Nissan Chemical Corporation
- Methods for processing a substrate1 Mar 2022US 11,260,646 B2Corning Incorporated
- Detaching a die from an adhesive tape by air ejection20 Oct 2022US 2022/0336254 A1Asm Technology Singapore Pte Ltd
- Method and apparatus for transferring micro device, and electronic product using the same3 Jun 2021US 2021/0166959 A1Korea Institute of Machinery & Materials
- Apparatus for separating a window and method for separating a window using the same11 Mar 2021US 2021/0070030 A1Samsung Display Co., Ltd.
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device19 Nov 2020US 2020/0365430 A1Mitsubishi Electric Corporation
- Chip ejecting apparatus17 Sep 2020US 2020/0294839 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Controlled cleavage process and device for patterned films344US 6,528,391 B1Silicon Genesis Corporation · 2003
- Controlled cleaving process280US 7,371,660 B2Silicon Genesis Corporation · 2008
- Controlled cleaning process180US 6,013,563 ASilicon Genesis Corporation · 2000
- Controlled cleavage process using pressurized fluid178US 5,994,207 ASilicon Genesis Corporation · 1999