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AssigneeNissan Chemical Corporation
InventorsTakahiro Kishioka, Mamoru Tamura, Yuki Usui, Hiroto Ogata
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A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.
A method for removing foreign matters, comprising the steps of:
A method for treating a substrate, comprising the steps of:
A method for producing a laminated substrate, comprising the steps of:
Dependencies are inferred from the claim text.