Y10S 134/902
Semiconductor wafer
Y10S134/902 (Semiconductor wafer) appears on 2,352 US grants and 1,177 published applications in this corpus.
Search patents in Y10S- Granted patents
- 2,352
- Published applications
- 1,177
- Assignees
- 550
- Inventors
- 3,083
- Latest grant
- 14 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 6 | 0 |
| 1978 | 6 | 0 |
| 1979 | 2 | 0 |
| 1980 | 7 | 0 |
| 1981 | 11 | 0 |
| 1982 | 7 | 0 |
| 1983 | 7 | 0 |
| 1984 | 16 | 0 |
| 1985 | 15 | 0 |
| 1986 | 6 | 0 |
| 1987 | 17 | 0 |
| 1988 | 23 | 0 |
| 1989 | 27 | 0 |
| 1990 | 26 | 0 |
| 1991 | 27 | 0 |
| 1992 | 25 | 0 |
| 1993 | 33 | 0 |
| 1994 | 44 | 0 |
| 1995 | 32 | 0 |
| 1996 | 53 | 0 |
| 1997 | 46 | 0 |
| 1998 | 90 | 0 |
| 1999 | 138 | 0 |
| 2000 | 154 | 0 |
| 2001 | 176 | 114 |
| 2002 | 216 | 201 |
| 2003 | 218 | 158 |
| 2004 | 172 | 178 |
| 2005 | 128 | 107 |
| 2006 | 100 | 90 |
| 2007 | 87 | 67 |
| 2008 | 97 | 72 |
| 2009 | 56 | 50 |
| 2010 | 64 | 36 |
| 2011 | 65 | 25 |
| 2012 | 52 | 30 |
| 2013 | 20 | 15 |
| 2014 | 30 | 15 |
| 2015 | 22 | 10 |
| 2016 | 4 | 1 |
| 2017 | 4 | 4 |
| 2018 | 6 | 1 |
| 2019 | 1 | 2 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Apparatus and method for processing substrate14 Jan 2025US 12,198,950 B2Semes Co., Ltd.
- Apparatus and method for contamination identification26 Apr 2022US 11,311,917 B2Bruker Nano, Inc.
- Substrate processing method and substrate processing system20 Jul 2021US 11,069,548 B2Tokyo Electron Limited
- Substrate processing method and substrate processing system3 Sep 2019US 10,403,525 B2Tokyo Electron Limited
- Substrate processing method for drying a substrate by discharging gas to liquid layer on the substrate while rotating the substrate20 Nov 2018US 10,134,610 B2SCREEN Semiconductor Solutions Co., Ltd.
- Apparatus and method for processing substrate5 Jan 2023US 2023/0005768 A1Semes Co., Ltd.
- Apparatus and method for processing substrate28 Nov 2019US 2019/0362993 A1Semes Co., Ltd.
- Substrate processing method and substrate processing system28 Nov 2019US 2019/0362996 A1Tokyo Electron Limited
- Substrate processing method and substrate processing system1 Mar 2018US 2018/0061692 A1Tokyo Electron Limited
- Method and apparatus for processing wafer-shaped articles9 Nov 2017US 2017/0323823 A1Lam Research Corporation
Most cited
By later US patents
- Accelerated plasma clean584US 6,374,831 B1APPLIED Materials.Inc. · 2002
- Parallel plate development with multiple holes in top plate for control of developer flow and pressure560US 6,688,784 B1Advanced Micro Devices, Inc. · 2004
- Semiconductor device manufacturing system534US 6,212,789 B1Canon Sales Co., Inc. · 2001
- Method of cleaning UV irradiation chamber527US 7,789,965 B2ASM Japan K .K. · 2010
- Method of cleaning CVD equipment processing chamber526US 7,234,476 B2ASM Japan K .K. · 2007