Method and apparatus for processing wafer-shaped articles
AssigneeLam Research Corporation
InventorsHongbo SI, Bhaskar BANDARAPU, Andreas GLEISSNER, Bernhard LOIDL
Life of this patent
Estimating the term…
Abstract
In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.
Claims22
Apparatus for treating a wafer-shaped article, comprising:
- a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a predetermined horizontal position;
- a non-rotating plate positioned relative to said spin chuck such that said non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on said spin chuck in said predetermined horizontal position;
- and
- a fluid dispensing nozzle passing through said non-rotating plate and terminating in a discharge end positioned above and adjacent to said non-rotating plate;
- said discharge end comprising a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of said non-rotating plate.
Apparatus for treating a wafer-shaped article, comprising:
- a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a predetermined horizontal position;
- a non-rotating plate positioned relative to said spin chuck such that said non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on said spin chuck in said predetermined horizontal position;
- a heating assembly comprising at least one radiant heating element positioned beneath said non-rotating plate,
- wherein said non-rotating plate is substantially transparent to radiation emitted by said at least one radiant heating element and said non-rotating plate is disposed between (i) said heating assembly and (ii) said-wafer shaped article when positioned on said spin chuck in said predetermined horizontal position;
- and
- a fluid dispensing nozzle passing through said non-rotating plate and said heating assembly and terminating in a discharge end positioned above and adjacent to said non-rotating plate;
- said discharge end comprising a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of said non-rotating plate.
Dependencies are inferred from the claim text.