Apparatus and method for processing substrate
AssigneeSemes Co., Ltd.
InventorsMyung A Jeon, Muhyeon Lee, Sul Lee
Life of this patent
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Abstract
Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.
Claims7
A method for removing an adhesive exposed from an object being processed, wherein the object has a patterned substrate and a support plate bonded together by the adhesive, the method comprising:
- removing the adhesive by dispensing a processing liquid onto an exposed area where the adhesive is exposed, while rotating the object, wherein the support plate has a larger diameter than the substrate, and the support plate and the substrate are rotated in a state of having the same center;
- and
- protecting the substrate from the processing liquid by dispensing a cover liquid onto a cover area of a top surface of the object other than the exposed area,
- wherein the processing liquid is dispensed by a processing liquid nozzle having a discharge opening downwardly inclined toward an outside of the object from top to bottom,
- wherein the cover liquid forms a cover liquid film, and then the processing liquid is dispensed by the processing liquid nozzle, and
- wherein a flow rate of the cover liquid is adjusted to cause a removal rate of the adhesive to remain constant.
Dependencies are inferred from the claim text.