H10W 80/337
Causing reflow
Official title: {causing reflow}
H10W80/337 (Causing reflow) appears on 7 US grants and 10 published applications in this corpus.
Search patents in H10W- Granted patents
- 7
- Published applications
- 10
- Assignees
- 6
- Inventors
- 21
- Latest grant
- 5 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 2 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 0 | 1 |
| 2020 | 2 | 1 |
| 2021 | 0 | 2 |
| 2022 | 1 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
By publication year.
Recent patents
- Process for mounting a matrix-array electroluminescent component on a carrier5 Nov 2024US 12,136,685 B2Valeo Vision
- Semiconductor package28 Nov 2023US 11,830,861 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing joined structure20 Sep 2022US 11,446,752 B2Koki Company Limited
- Semiconductor package6 Oct 2020US 10,797,031 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for bonding substrates together, and substrate bonding device3 Mar 2020US 10,580,752 B2Bondtech Co., Ltd.
- Semiconductor package21 Dec 2023US 2023/0411373 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing joined structure26 Aug 2021US 2021/0260679 A1Koki Company Limited
- Semiconductor package7 Jan 2021US 2021/0005591 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package26 Mar 2020US 2020/0098736 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Process for mounting a matrix-array electroluminescent component on a carrier4 Jul 2019US 2019/0207056 A1Valeo Vision
Most cited
By later US patents
- Hermetic wafer-to-wafer bonding with electrical interconnection104US 8,433,402 B2Medtronic, Inc. · 2013
- Semiconductor package48US 10,797,031 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2020
- Method for bonding substrates together, and substrate bonding device6US 10,580,752 B2Bondtech Co., Ltd. · 2020
- Method for bonding substrates5US 9,859,246 B2EV Group E. Thallner GmbH · 2018
- Semiconductor package1US 11,830,861 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2023