Method for producing joined structure
AssigneeKoki Company Limited
InventorsSatoshi Ootani, Mitsuyasu Furusawa
Life of this patent
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Abstract
A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.
Claims20
A method for producing a joined structure, the method comprising:
- a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material,
- the reflow step comprising:
- a first reflow step consists of reducing an atmosphere in the reflow chamber from the atmospheric pressure to a first pressure P1 in a single step and keeping the first pressure P1 before the solder alloy is molten, and then melting the solder alloy;
- and
- a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.
Dependencies are inferred from the claim text.