Process for mounting a matrix-array electroluminescent component on a carrier

Process for mounting a light component on a carrier,

• characterized in that the light component comprises a generally planar substrate, on a first face of which submillimetre-sized electroluminescent semiconductor elements are epitaxied in the form of a matrix, and in that the process comprises the following steps:
• forming at least one electrically conductive track on the second face of the substrate of the light component;
• forming at least one electrically conductive track on a face of the carrier;
• positioning the light component on said face of the carrier such that the electrically conductive tracks of the component and of the carrier make contact;
• annealing the assembly composed of the carrier and of the light component at a temperature of between 200° C. and 400° C.