Semiconductor package

A semiconductor package, comprising:

• a first optical transceiver, comprising:
• a first photonic integrated circuit component;
• and
• a first electric integrated circuit component electrically connected to the first photonic integrated circuit component;
• a second optical transceiver stacked on the first optical transceiver, comprising:
• a second photonic integrated circuit component;
• and
• a second electric integrated circuit component electrically connected to the second photonic integrated circuit component;
• a third optical transceiver stacked on the second optical transceiver, comprising:
• a third photonic integrated circuit component;
• and
• a third electric integrated circuit component electrically connected to the third photonic integrated circuit component;
• and
• a plasmonic waveguide penetrating through the second optical transceiver, wherein at least one of the first photonic integrated circuit component, the second photonic integrated circuit component, and the third photonic integrated circuit component is optically coupled to the plasmonic waveguide.

A semiconductor package, comprising;

• a first electric integrated circuit component;
• a second electric integrated circuit component disposed adjacent to the first electric integrated circuit component;
• and
• a first plasmonic bridge over the first electric integrated circuit component and the second electric integrated circuit component, wherein the first plasmonic bridge comprises a first electrical-optical conversion module, a second electrical-optical conversion module, and a first plasmonic waveguide optically connecting the first electrical-optical conversion module and the second electrical-optical conversion module, the first electrical-optical conversion module is electrically coupled to the first electric integrated circuit component, and the second electrical-optical conversion module is electrically coupled to the second electric integrated circuit component.