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US 9,859,246 B2Granted
Method for bonding substrates
AssigneeEV Group E. Thallner GmbH
InventorAndreas Fehkuhrer
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Abstract
A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.
Claims15
A method for bonding a first substrate to a second substrate, the method comprising:
- thinning the first substrate and/or the second substrate;
- prior to or after the thinning, fixing the first substrate and/or the second substrate to surfaces of respective elastically deformable carriers;
- and
- after the fixing and the thinning, bonding the first substrate to the second substrate by deforming at least one of the carriers,
- wherein a frame is disposed on each of the carrier surfaces,
- wherein an upper surface of the frame defines a carrier attaching surface,
- wherein each of the fixed first and/or second substrates has a side that faces away the carrier surface, and
- wherein, relative to the carrier surface, a height of the side of the fixed first and/or second substrates is less than a height of the carrier attaching surface.
5 more elements
Dependencies are inferred from the claim text.