H10W 72/07623
Active alignment
Official title: {Active alignment, e.g. using optical alignment using marks or sensors}
H10W72/07623 (Active alignment) appears on 4 US grants and 5 published applications in this corpus.
Search patents in H10W- Granted patents
- 4
- Published applications
- 5
- Assignees
- 4
- Inventors
- 12
- Latest grant
- 13 Jun 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 1 | 0 |
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Recent patents
- Clip bond semiconductor packages and assembly tools13 Jun 2023US 11,676,934 B2UTAC Headquarters Pte. Ltd.
- Wiring member and semiconductor module including same18 Oct 2022US 11,476,224 B2Mitsubishi Electric Corporation
- Semiconductor device with high quality and reliability wiring connection, and method for manufacturing the same7 Apr 2020US 10,615,131 B2Mitsubishi Electric Corporation
- Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims4 Oct 2016US 9,460,938 B2Renesas Electronics Corporation
- Clip bond semiconductor packages and assembly tools22 Apr 2021US 2021/0118840 A1UTAC Headquarters Pte. Ltd.
- Wiring member and semiconductor module including same17 Dec 2020US 2020/0395329 A1Mitsubishi Electric Corporation
- Semiconductor device and method for manufacturing the same25 Apr 2019US 2019/0122998 A1Mitsubishi Electric Corporation
- Semiconductor Device Circuit Apparatus Bonded with Anisotropic Conductive Film and Method of Direct Transfer for Making the Same30 Aug 2018US 2018/0248090 A1Rohinni, LLC
- Semiconductor device6 Nov 2014US 2014/0327138 A1Renesas Electronics Corporation
Most cited
By later US patents