Semiconductor device with high quality and reliability wiring connection, and method for manufacturing the same

A method for manufacturing a semiconductor device, the method comprising:

• preparing a metal plate, a semiconductor element including a first electrode provided on a front surface and a second electrode provided on a back surface, the semiconductor element being held on the metal plate by the second electrode being connected to the metal plate, a wiring board including a first surface and a second surface facing each other, and a conductor having a plate-like shape;
• connecting the first surface of the wiring board to the first electrode of the semiconductor element in facing manner;
• and
• arranging one end of the conductor so as to be connectable to an outside, fixing one surface side of another end of the conductor to the second surface of the wiring board, and wiring the conductor to the first electrode of the semiconductor element, wherein
• the conductor includes at least one protruding step on the one surface of the other end,
• a top portion of the at least one protruding step included in the conductor includes a contact surface, and
• the step of fixing the one surface side of the other end of the conductor to the second surface of the wiring board includes
• placing the conductor so that the contact surface comes into contact with the second surface of the wiring board parallely,
• bringing the contact surface of the conductor into close contact with the second surface of the wiring board by laser joining the contact surface of the conductor and the second surface of the wiring board, and fixing the other end of the conductor to the second surface of the wiring board.