Semiconductor Device Circuit Apparatus Bonded with Anisotropic Conductive Film and Method of Direct Transfer for Making the Same
AssigneeRohinni, LLC
InventorsAndrew Huska, Cody Peterson, Clinton Adams, Sean Kupcow, Justin Wendt
Life of this patent
Estimating the term…
Abstract
An apparatus includes a circuit substrate including a circuit trace and a micro-sized semiconductor device die electrically connected to the circuit substrate. The micro-sized semiconductor device die has a height not greater than 400 microns and a width not greater than 800 microns. An anisotropic conductive adhesive (“ACA”) is disposed between the circuit substrate and the micro-sized semiconductor device die, thereby providing an electrical connection from the circuit substrate to the micro-sized semiconductor device die.
Claims20
An apparatus comprising:
- a circuit substrate including a circuit trace, the circuit trace comprising a first electrical contact;
- a micro-sized semiconductor device die electrically connected to the circuit substrate, the micro-sized semiconductor device die having a height not greater than 400 microns and a width not greater than 800 microns, the micro-sized semiconductor device die comprising a second electrical contact;
- and
- an anisotropic conductive adhesive (“ACA”) disposed directly on the circuit substrate so as to be between the circuit substrate and the micro-sized semiconductor device die, the ACA providing an electrical connection from the first electrical contact of the circuit substrate to the second electrical contact of the micro-sized semiconductor device die.
A method of forming an apparatus including a circuit substrate, a micro-sized semiconductor device die electrically connected to the circuit substrate, the micro-sized semiconductor device die having a height not greater than 400 microns and a width not greater than 800 microns, and an anisotropic conductive adhesive (“ACA”) disposed between the circuit substrate and the micro-sized semiconductor device die, the method comprising:
- loading a semiconductor holding substrate into a frame, the semiconductor holding substrate having attached thereto the micro-sized semiconductor device die;
- placing the ACA directly on the circuit substrate;
- aligning the circuit substrate with the semiconductor holding substrate;
- and
- executing a direct transfer operation in which the micro-sized semiconductor device die is transferred directly from the semiconductor holding substrate to the circuit substrate such that the ACA bonds the micro-sized semiconductor device die to a circuit trace of the circuit substrate, the ACA providing electrical connectivity between the circuit substrate and the micro-sized semiconductor die.
Dependencies are inferred from the claim text.