Wiring member and semiconductor module including same

13:

• The wiring member according to claim 12, wherein the upper surface portion projects in a direction opposite to a direction toward:
• a connection surface, with the first conduction portion, of the first connection portion;
• and a connection surface, with the second conduction portion, of the second connection portion.

14:

• The wiring member according to claim 12, wherein the upper surface portion is provided parallel to the first connection portion and the second connection portion.

15:

• The wiring member according to claim 12, wherein the first connection portion, the second connection portion, and the upper surface portion are at height positions different from one another.

16:

• The wiring member according to claim 14, wherein the first connection portion, the second connection portion, and the upper surface portion are at height positions different from one another.

17:

• The wiring member according to claim 12, wherein either or both of the projections and the recesses are symmetrically provided to both side surfaces of the upper surface portion.

18:

• The wiring member according to claim 14, wherein either or both of the projections and the recesses are symmetrically provided to both side surfaces of the upper surface portion.

19:

• The wiring member according to claim 15, wherein either or both of the projections and the recesses are symmetrically provided to both side surfaces of the upper surface portion.

20:

• The wiring member according to claim 12, wherein either or both of the projections and the recesses are asymmetrically provided to both side surfaces of the upper surface portion.

21:

• The wiring member according to claim 14, wherein either or both of the projections and the recesses are asymmetrically provided to both side surfaces of the upper surface portion.

22:

• The wiring member according to claim 15, wherein either or both of the projections and the recesses are asymmetrically provided to both side surfaces of the upper surface portion.

23:

• The wiring member according to claim 12, wherein the first connection portion has a through hole formed in a direction perpendicular to a connection surface, with the first conduction portion, of the first connection portion.

24:

• The wiring member according to claim 17, wherein the first connection portion has a through hole formed in a direction perpendicular to a connection surface, with the first conduction portion, of the first connection portion.

25:

• The wiring member according to claim 20, wherein the first connection portion has a through hole formed in a direction perpendicular to a connection surface, with the first conduction portion, of the first connection portion.

26:

• The wiring member according to claim 12, wherein the second connection portion has a through hole formed in a direction perpendicular to a connection surface, with the second conduction portion, of the second connection portion.

27:

• The wiring member according to claim 17, wherein the second connection portion has a through hole formed in a direction perpendicular to a connection surface, with the second conduction portion, of the second connection portion.

28:

• The wiring member according to claim 20, wherein the second connection portion has a through hole formed in a direction perpendicular to a connection surface, with the second conduction portion, of the second connection portion.

29:

• The wiring member according to claim 12, wherein the projections are integrated with the upper surface portion.

30:

• The wiring member according to claim 12, wherein a chamfer is formed at a corner of the first connection portion or the second connection portion.