H10P 90/21

Preparation of wafers not covered by a single main group of this

Official title: {by transferring two-dimensional materials}

H10P90/21 (Preparation of wafers not covered by a single main group of this) appears on 5 US grants and 8 published applications in this corpus.

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Granted patents
5
Published applications
8
Assignees
6
Inventors
15
Latest grant
27 Feb 2024

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H10P 90/21: granted patents and published applications per publication year
YearGranted patentsPublished applications
201701
201801
201912
202021
202110
202200
202301
202410
202500
202602

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