H10P 72/3204
Using magnetic elements
Official title: {using magnetic elements}
H10P72/3204 (Using magnetic elements) appears on 226 US grants and 295 published applications in this corpus.
Search patents in H10P- Granted patents
- 226
- Published applications
- 295
- Assignees
- 114
- Inventors
- 553
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 2 |
| 2002 | 6 | 7 |
| 2003 | 5 | 4 |
| 2004 | 2 | 2 |
| 2005 | 1 | 2 |
| 2006 | 0 | 7 |
| 2007 | 3 | 4 |
| 2008 | 2 | 4 |
| 2009 | 3 | 5 |
| 2010 | 5 | 3 |
| 2011 | 2 | 4 |
| 2012 | 3 | 2 |
| 2013 | 2 | 11 |
| 2014 | 5 | 12 |
| 2015 | 10 | 8 |
| 2016 | 8 | 10 |
| 2017 | 12 | 8 |
| 2018 | 8 | 9 |
| 2019 | 10 | 17 |
| 2020 | 6 | 17 |
| 2021 | 9 | 29 |
| 2022 | 18 | 24 |
| 2023 | 9 | 21 |
| 2024 | 20 | 27 |
| 2025 | 23 | 37 |
| 2026 | 23 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing system and substrate transfer method8 Sep 2026US 12,733,437 B2Tokyo Electron Limited
- Semiconductor process equipment1 Sep 2026US 12,727,430 B2APPLIED Materials.Inc.
- Magnetic sensor assembly11 Aug 2026US 12,703,586 B2APPLIED Materials.Inc.
- Semiconductor process equipment14 Jul 2026US 12,685,078 B2APPLIED Materials.Inc.
- Modular material handling robot platform14 Jul 2026US 12,685,079 B2Persimmon Technologies Corporation
- Substrate processing apparatus for double-sided sputtering27 Aug 2026US 2026/0253851 A1Sea, Ltd.
- Substrate Transfer Apparatus and Substrate Transfer Method23 Jul 2026US 2026/0214750 A1Tokyo Electron Limited
- Common rail handling equipment23 Jul 2026US 2026/0215215 A1Sanwa Engineering Corp.
- Substrate Transfer Apparatus and Substrate Transfer Method23 Jul 2026US 2026/0215224 A1Tokyo Electron Limited
- Substrate processing system and movable maintenance apparatus16 Jul 2026US 2026/0198679 A1Tokyo Electron Limited
Most cited
By later US patents
- Magnetic levitation conveyor apparatus136US 5,641,054 AEbara Corporation · 1997
- Substrate transfer shuttle having a magnetic drive131US 6,206,176 B1Applied Komatsu Technology, Inc. · 2001
- Linear substrate transport apparatus120US 7,988,398 B2Brooks Automation, Inc. · 2011
- Wafer transport device107US 5,417,537 A1995
- Substrate processing apparatus96US 7,575,406 B2Brooks Automation, Inc. · 2009