H10P 72/175
Characterised by a material, a roughness, a coating or the like
Official title: {characterised by a material, a roughness, a coating or the like}
H10P72/175 (Characterised by a material, a roughness, a coating or the like) appears on 12 US grants and 13 published applications in this corpus.
Search patents in H10P- Granted patents
- 12
- Published applications
- 13
- Assignees
- 13
- Inventors
- 53
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 1 |
| 2022 | 0 | 1 |
| 2023 | 0 | 2 |
| 2024 | 4 | 3 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge24 Mar 2026US 12,588,463 B2STATS ChipPAC Pte. Ltd.
- Anti-slip pad and tray including same16 Sep 2025US 12,415,669 B2Samsung Display Co., Ltd.
- Fluidic assembly MicroLED mass transfer method29 Oct 2024US 12,132,034 B2eLux, Inc.
- Anti-slip pad and tray including same18 Jun 2024US 12,012,272 B2Samsung Display Co., Ltd.
- Fluidic assembly carrier substrate for microLED mass transfer21 May 2024US 11,990,453 B2eLux, Inc.
- Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge24 Oct 2024US 2024/0355655 A1STATS ChipPAC Pte. Ltd.
- Anti-slip pad and tray including same19 Sep 2024US 2024/0308751 A1Samsung Display Co., Ltd.
- Fluidic Assembly MicroLED Mass Transfer Method2 May 2024US 2024/0145443 A1eLux, Inc.
- Fluidic Assembly Carrier Substrate for MicroLED Mass Transfer10 Aug 2023US 2023/0253377 A1eLux, Inc.
- Packaging device and manufacturing method thereof25 May 2023US 2023/0163004 A1Beijing Boe Display Technology Co., Ltd.
Most cited
By later US patents
- Substrate-supporting side boards and a cassette utilizing the boards29US 5,584,401 AYodogawa Kasei Kabushiki Kaisha · 1996
- Carrier for flat panel displays28US 4,930,634 AFluoroware, Inc. · 1990
- Elongated rib for cassette and substrate cassette12US 6,523,701 B1Sharp Kabushiki Kaisha · 2003
- Apparatus and method for measuring static charge on wafers, disks, substrates, masks, and flat panel displays7US 6,719,142 B1Ion Systems, Inc. · 2004
- Substrate supporting rod and substrate cassette using the same7US 7,334,690 B2Foxsemicon Integrated Technology, Inc. · 2008