Substrate-supporting side boards and a cassette utilizing the boards
AssigneeYodogawa Kasei Kabushiki Kaisha
InventorToshio Yoshida
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AssigneeYodogawa Kasei Kabushiki Kaisha
InventorToshio Yoshida
Estimating the term…
The invention provides a cassette which is sufficiently sturdy even though its side boards are of narrow width, is protected against static charging in the insertion and removal of substrates and, hence, against circuit failure, and is not liable to form a dust of friction. The invention further provides an improved substrate-supporting side board for use in the fabrication of a cassette. The above substrate-supporting side board comprises a metal core, an overlay and a plurality of shelf members, at least the frontal part of the overlay and the shelf members being made of resin, the shelf members being tongue-shaped projections arising from the overlay and extending in parallel and inwardly of the cassette frame at a predetermined pitch with an upward inclination toward free ends thereof, the supporting surface of each shelf member being slightly elevated in the center with respect to its flanks, and at least part of the portion of the resin which is to contact a substrate being molded from a dust-inhibited resin molding material, with the remainder being molded from an electrically conductive resin molding material.
A substrate-supporting side board to be assembled with a cassette frame for supporting substrates which comprises a metal core, an overlay and a plurality of shelf members, at least the frontal part of said overlay and the shelf members being made of resin, said shelf members being tongue-shaped projections arising from said overlay and extending in parallel and inwardly of the cassette at a predetermined pitch with an upward inclination toward the free ends thereof, the supporting surface of each of said shelf members being slightly elevated in the center from its flank parts, and at least part of the portion of the resin which is to contact substrates being molded from a dust-inhibited resin molding material with the remainder of said resin being molded from an electrically conductive resin molding material.
Dependencies are inferred from the claim text.