H10P 72/0444
Apparatus for wiring semiconductor or solid-state device
Official title: {Apparatus for wiring semiconductor or solid-state device}
H10P72/0444 (Apparatus for wiring semiconductor or solid-state device) appears on 308 US grants and 171 published applications in this corpus.
Search patents in H10P- Granted patents
- 308
- Published applications
- 171
- Assignees
- 168
- Inventors
- 647
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 13 | 0 |
| 1990 | 4 | 0 |
| 1991 | 17 | 0 |
| 1992 | 13 | 0 |
| 1993 | 9 | 0 |
| 1994 | 7 | 0 |
| 1995 | 8 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 9 | 0 |
| 2000 | 6 | 0 |
| 2001 | 23 | 6 |
| 2002 | 10 | 11 |
| 2003 | 10 | 16 |
| 2004 | 10 | 14 |
| 2005 | 13 | 7 |
| 2006 | 9 | 9 |
| 2007 | 4 | 3 |
| 2008 | 8 | 10 |
| 2009 | 3 | 6 |
| 2010 | 4 | 6 |
| 2011 | 3 | 4 |
| 2012 | 2 | 4 |
| 2013 | 5 | 4 |
| 2014 | 2 | 2 |
| 2015 | 3 | 4 |
| 2016 | 2 | 2 |
| 2017 | 3 | 8 |
| 2018 | 3 | 10 |
| 2019 | 10 | 8 |
| 2020 | 9 | 10 |
| 2021 | 7 | 4 |
| 2022 | 7 | 4 |
| 2023 | 2 | 2 |
| 2024 | 3 | 8 |
| 2025 | 8 | 6 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inertial sensor, method of manufacturing inertial sensor, and inertial measurement unit28 Jul 2026US 12,693,307 B2Seiko Epson Corporation
- Wire bonding system, inspection device, wire bonding method, and recording medium2 Dec 2025US 12,489,003 B2Yamaha Robotics Co., Ltd.
- Method for manufacturing display device11 Nov 2025US 12,469,731 B2LG Electronics Inc.
- Electronic apparatus with polarization plate and manufacturing method thereof16 Sep 2025US 12,417,929 B2Samsung Display Co., Ltd.
- Device for manufacturing side line, method of manufacturing side line and method of manufacturing display device29 Jul 2025US 12,376,274 B2LG Display Co., Ltd.
- Double-sided soldering method for solar cell21 May 2026US 2026/0143857 A1Changzhou Shichuang Energy Co., Ltd
- Method of joining electrical and mechanical components using laminated modular preforms30 Apr 2026US 2026/0123502 A1Alpha Assembly Solutions Inc.
- Semiconductor manufacturing tool19 Mar 2026US 2026/0082858 A1
- Device for manufacturing side line, method of manufacturing side line and method of manufacturing display device23 Oct 2025US 2025/0331143 A1LG Display Co., Ltd.
- Apparatus, system, and method of providing a ramped interconnect for semiconductor fabrication2 Oct 2025US 2025/0308956 A1Jabil Inc.
Most cited
By later US patents
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of stacking electronic components180US 5,926,951 AFormFactor, Inc. · 1999
- Device having resin package with projections160US 6,072,239 AFujitsu Limited · 2000
- Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method152US 5,900,738 AFormFactor, Inc. · 1999
- Method and tool for handling micro-mechanical structures146US 6,255,721 B1Read-Rite Corporation · 2001