Method of stacking electronic components

A method of stacking electronic components, comprising:

• providing a first electronic component having a first interconnection substrate with a first set of contact pads on at least a first surface thereof, and at least a first semiconductor device with resilient contact structures mounted thereto, extending therefrom and electrically contacting the first set of contact pads of the first interconnection substrate;
• providing a second electronic component having a second interconnection substrate with a second set of contact pads on at least one surface thereof, and at least a second semiconductor device with resilient contact structures mounted to, extending therefrom and electrically contacting the second set of contact pads of the second interconnection substrate;
• providing a one of the first interconnection substrate and the second interconnection substrate with a third set of contact pads on a surface thereof;
• and
• providing an other of the first interconnection substrate and the second interconnection substrate with resilient contact structures mounted to, extending therefrom and electrically contacting the third set of contact pads of the one of the first interconnection substrate and the second interconnection substrate.