H10N 30/086
By polishing or grinding
Official title: by polishing or grinding
H10N30/086 (By polishing or grinding) appears on 104 US grants and 146 published applications in this corpus.
Search patents in H10N- Granted patents
- 104
- Published applications
- 146
- Assignees
- 65
- Inventors
- 272
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 4 |
| 2003 | 0 | 1 |
| 2004 | 0 | 3 |
| 2005 | 3 | 3 |
| 2006 | 3 | 3 |
| 2007 | 1 | 3 |
| 2008 | 4 | 2 |
| 2009 | 2 | 2 |
| 2010 | 1 | 4 |
| 2011 | 1 | 1 |
| 2012 | 2 | 7 |
| 2013 | 4 | 1 |
| 2014 | 2 | 3 |
| 2015 | 4 | 1 |
| 2016 | 4 | 5 |
| 2017 | 2 | 5 |
| 2018 | 3 | 13 |
| 2019 | 3 | 9 |
| 2020 | 13 | 14 |
| 2021 | 9 | 13 |
| 2022 | 9 | 10 |
| 2023 | 13 | 11 |
| 2024 | 6 | 11 |
| 2025 | 9 | 9 |
| 2026 | 3 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heterostructure and method of fabrication22 Sep 2026US 12,744,508 B2Soitec
- Piezoelectric acoustic resonator with dielectric protective layer manufactured with piezoelectric thin film transfer process15 Sep 2026US 12,738,916 B2Akoustis Technologies Corp.
- Piezoelectric acoustic resonator with improved TCF manufactured with piezoelectric thin film transfer process10 Mar 2026US 12,573,995 B2Akoustis Technologies Corp.
- Substrate thinning process using temporary bond with low thickness variation23 Dec 2025US 12,507,593 B2Corning Incorporated
- Piezoelectric device23 Dec 2025US 12,507,594 B2Murata Manufacturing Co., Ltd.
- Method for preparing a single-domain thin layer made of lithium-containing ferroelectric material1 Oct 2026US 2026/0305174 A1
- Composite substrate and preparation method therefor6 Aug 2026US 2026/0231682 A1Tiantong Ruihong Technology Co., Ltd.
- Piezoelectric acoustic resonator with improved tcf manufactured with piezoelectric thin film transfer process25 Jun 2026US 2026/0180537 A1Akoustis Technologies Corp.
- Method for correcting the thickness of a layer11 Jun 2026US 2026/0158776 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method for preparing a thin layer of ferroelectric material11 Jun 2026US 2026/0165029 A1
Most cited
By later US patents
- Bimorph MEMS devices37US 7,084,554 B2Palo Alto Research Center Incorporated · 2006
- Methods to make bimorph MEMS devices30US 6,895,645 B2Palo Alto Research Center Incorporated · 2005
- Laminated type piezoelectric actuator21US 5,252,883 ANEC Corporation · 1993
- Method for making a spiral array ultrasound transducer21US 7,247,269 B2Biosense Webster, Inc. · 2007
- Piezoelectric component and method for the manufacture thereof13US 6,232,701 B1Epcos AG · 2001