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US 12,507,593 B2Granted
Substrate thinning process using temporary bond with low thickness variation
AssigneeCorning Incorporated
InventorsIndrani Bhattacharyya, Julia Anne Dorothee Brueckner, Ya-Huei Chang, Bokyung Kong, Prantik Mazumder, Jun Ro Yoon, Jian-Zhi Jay Zhang
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Abstract
An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the support substrate. Furthermore, a total thickness variation TTV across a width of the support unit is about 2.0 microns or less.
Claims16
An article comprising:
- a support unit comprising:
- a support substrate comprised of glass, glass ceramic, ceramic, or silicon and having a surface;
- and
- a bonding layer directly bonded to the surface of the support substrate,
- wherein a total thickness variation TTV across an entire width of the bonding layer is about 3.0 microns or less and a total thickness variation TTV across an entire width of the support unit is about 2.0 microns or less.
2 more elements
An article comprising:
- a support unit comprising:
- a support substrate comprised of glass, glass ceramic, ceramic, or silicon and having a surface;
- and
- a bonding layer directly bonded to the surface of the support substrate,
- wherein a total thickness variation TTV across an entire width of the bonding layer is about 3.0 microns or less and a total thickness variation TTV across a width of the support unit is about 2.0 microns or less;
- a first substrate, the bonding layer coupling the support substrate with the first substrate;
- and
- a device support wafer removably coupled with the support substrate.
5 more elements
Dependencies are inferred from the claim text.