H10N 30/06
Forming electrodes or interconnections
Official title: Forming electrodes or interconnections, e.g. leads or terminals
H10N30/06 (Forming electrodes or interconnections) appears on 1,104 US grants and 1,321 published applications in this corpus.
Search patents in H10N- Granted patents
- 1,104
- Published applications
- 1,321
- Assignees
- 471
- Inventors
- 2,610
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 9 | 3 |
| 2002 | 7 | 10 |
| 2003 | 9 | 13 |
| 2004 | 10 | 13 |
| 2005 | 8 | 16 |
| 2006 | 16 | 30 |
| 2007 | 11 | 17 |
| 2008 | 10 | 17 |
| 2009 | 17 | 23 |
| 2010 | 21 | 34 |
| 2011 | 15 | 32 |
| 2012 | 26 | 52 |
| 2013 | 27 | 75 |
| 2014 | 38 | 66 |
| 2015 | 59 | 71 |
| 2016 | 62 | 72 |
| 2017 | 73 | 101 |
| 2018 | 64 | 119 |
| 2019 | 92 | 103 |
| 2020 | 97 | 77 |
| 2021 | 60 | 81 |
| 2022 | 77 | 69 |
| 2023 | 66 | 66 |
| 2024 | 54 | 71 |
| 2025 | 46 | 49 |
| 2026 | 43 | 41 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for detecting impact to composite structures6 Oct 2026US 12,754,088 B2Hexagon Technology AS
- Manufacturing method of piezoelectric element, piezoelectric element, and liquid droplet dispensing head22 Sep 2026US 12,745,565 B2Seiko Epson Corporation
- Piezoelectric element and manufacturing method for piezoelectric element22 Sep 2026US 12,745,567 B2FUJIFILM Corporation
- Protection of sensing element during moulding15 Sep 2026US 12,736,428 B2Melexis Technologies SA
- Piezoelectric acoustic resonator with dielectric protective layer manufactured with piezoelectric thin film transfer process15 Sep 2026US 12,738,916 B2Akoustis Technologies Corp.
- Method for manufacturing array sensor element and array sensor element1 Oct 2026US 2026/0305173 A1Seiko Epson Corporation
- Acoustic Devices And Methods Of Fabrication24 Sep 2026US 2026/0293530 A1Sonocharge Energy, Inc
- Piezoelectric actuator and liquid ejecting head17 Sep 2026US 2026/0273934 A1Canon Kabushiki Kaisha
- Solidly-mounted acoustic biosensor17 Sep 2026US 2026/0276601 A1Resonatia Diagnostics
- Piezoelectric laminate, piezoelectric element, and method for manufacturing piezoelectric laminate17 Sep 2026US 2026/0282750 A1AGC Inc.
Most cited
By later US patents
- Method for manufacturing a vibrating MEMS circuit263US 9,369,105 B1RF Micro Devices, Inc. · 2016
- Temperature compensated surface acoustic wave device and methods of manufacturing the same196US 10,284,176 B1Qorvo US, Inc. · 2019
- Resonator, frequency filter, duplexer, electronic device, and method of manufacturing resonator160US 9,112,134 B2Taiyo Yuden Co., Ltd. · 2015
- Method for providing a piezoelectric multilayer124US 8,813,324 B2Western Digital (Fremont), LLC · 2014
- Transversely-excited film bulk acoustic resonator with lateral etch stop113US 10,911,021 B2Resonant Inc. · 2021