H10N 30/063
Forming interconnections
Official title: Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
H10N30/063 (Forming interconnections) appears on 235 US grants and 274 published applications in this corpus.
Search patents in H10N- Granted patents
- 235
- Published applications
- 274
- Assignees
- 140
- Inventors
- 598
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 2 |
| 2002 | 1 | 5 |
| 2003 | 4 | 3 |
| 2004 | 7 | 3 |
| 2005 | 3 | 5 |
| 2006 | 4 | 9 |
| 2007 | 4 | 6 |
| 2008 | 3 | 6 |
| 2009 | 5 | 8 |
| 2010 | 7 | 10 |
| 2011 | 5 | 9 |
| 2012 | 6 | 10 |
| 2013 | 6 | 18 |
| 2014 | 9 | 19 |
| 2015 | 19 | 23 |
| 2016 | 10 | 10 |
| 2017 | 21 | 20 |
| 2018 | 13 | 15 |
| 2019 | 19 | 19 |
| 2020 | 19 | 8 |
| 2021 | 8 | 12 |
| 2022 | 14 | 14 |
| 2023 | 12 | 7 |
| 2024 | 8 | 11 |
| 2025 | 6 | 15 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Protection of sensing element during moulding15 Sep 2026US 12,736,428 B2Melexis Technologies SA
- Transducer and method for manufacturing same18 Aug 2026US 12,713,184 B2Rohm Co., Ltd.
- Piezoelectric element and method for manufacturing piezoelectric element14 Apr 2026US 12,603,587 B2Daegu Gyeongbuk Institute of Science and Technology
- Laminated piezoelectric element14 Apr 2026US 12,604,666 B2TDK Corporation
- Piezoelectric device including piezoelectric body layer with positive and negative polarization charges3 Mar 2026US 12,568,767 B2Murata Manufacturing Co., Ltd.
- Solidly-mounted acoustic biosensor17 Sep 2026US 2026/0276601 A1Resonatia Diagnostics
- Haptic response integrated circuit device with piezoelectric structures2 Jul 2026US 2026/0190864 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Piezoelectric valve21 May 2026US 2026/0139756 A1SMC Corporation
- Piezoelectric element14 May 2026US 2026/0136836 A1KYOCERA Corporation
- Passive magneto electric transducer23 Apr 2026US 2026/0110553 A1Melexis Bulgaria Eood
Most cited
By later US patents
- Method for providing a piezoelectric multilayer124US 8,813,324 B2Western Digital (Fremont), LLC · 2014
- Surface deformation electroactive polymer transducers84US 8,222,799 B2Bayer MaterialScience AG · 2012
- Laminated piezoelectric transducer59US 4,845,399 ANippon Soken, Inc. · 1989
- Piezoelectric lamination actuator54US 5,438,232 AMurata Manufacturing Co., Ltd. · 1995
- Laminate-type piezoelectric element and method of producing the same49US 7,554,250 B2Denso Corporation · 2009