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US 2026/0293530 A1Published application
Acoustic Devices And Methods Of Fabrication
AssigneeSonocharge Energy, Inc
InventorsWilliam CONNACHER, An HUANG, Haodong LIU
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Abstract
In one aspect, the present disclosure provides an acoustic device comprising: a piezoelectric substrate; and a multi-layer metallic stack comprising a bonding layer, a conduction layer, and a cap layer, wherein the bonding layer is configured to facilitate bonding of the conduction layer to the piezoelectric substrate, and the cap layer is configured to facilitate soldering of the acoustic device to an electrical circuit.
Claims20
An acoustic device comprising:
- a piezoelectric substrate;
- and
- a multi-layer metallic stack comprising a bonding layer, a conduction layer, and a cap layer, wherein:
- the bonding layer is configured to facilitate bonding of the conduction layer to the piezoelectric substrate, and
- the cap layer is configured to facilitate soldering of the acoustic device to an electrical circuit.
2 more elements
Dependencies are inferred from the claim text.