H10N 30/02
Forming enclosures or casings
H10N30/02 (Forming enclosures or casings) appears on 261 US grants and 320 published applications in this corpus.
Search patents in H10N- Granted patents
- 261
- Published applications
- 320
- Assignees
- 162
- Inventors
- 676
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 1 |
| 2002 | 3 | 5 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 4 |
| 2006 | 4 | 2 |
| 2007 | 4 | 7 |
| 2008 | 0 | 6 |
| 2009 | 1 | 11 |
| 2010 | 4 | 13 |
| 2011 | 5 | 6 |
| 2012 | 8 | 5 |
| 2013 | 5 | 10 |
| 2014 | 7 | 21 |
| 2015 | 9 | 16 |
| 2016 | 12 | 11 |
| 2017 | 15 | 15 |
| 2018 | 16 | 26 |
| 2019 | 12 | 25 |
| 2020 | 20 | 25 |
| 2021 | 15 | 30 |
| 2022 | 25 | 20 |
| 2023 | 26 | 23 |
| 2024 | 19 | 20 |
| 2025 | 10 | 8 |
| 2026 | 23 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Surface acoustic wave device6 Oct 2026US 12,756,375 B2United Microelectronics Corp.
- Multi-patch array, ultrasound system, and method for obtaining an extended field of view22 Sep 2026US 12,740,762 B2Koninklijke Philips N. V.
- Piezoelectric acoustic resonator with dielectric protective layer manufactured with piezoelectric thin film transfer process15 Sep 2026US 12,738,916 B2Akoustis Technologies Corp.
- Method of manufacture and use of a flexible computerized sensing device18 Aug 2026US 12,713,533 B2Velvetwire LLC
- Acoustic wave device4 Aug 2026US 12,700,845 B2Murata Manufacturing Co., Ltd.
- Multilayer piezoelectric body and method for manufacturing same13 Aug 2026US 2026/0239885 A1Kureha Corporation
- Method For Manufacturing Device9 Jul 2026US 2026/0198227 A1Seiko Epson Corporation
- Piezoelectric acoustic resonator with improved tcf manufactured with piezoelectric thin film transfer process25 Jun 2026US 2026/0180537 A1Akoustis Technologies Corp.
- Piezoelectric module and its assembly method28 May 2026US 2026/0150581 A1Bergsonne Labs GmbH
- Fabrication methods of semiconductor substrates30 Apr 2026US 2026/0123285 A1Vanguard International Semiconductor Corporation
Most cited
By later US patents
- Method for producing an electronic component using direct bonding273US 5,771,555 AMatsushita Electric Industrial Co., Ltd. · 1998
- Packaged strain actuator72US 6,069,433 AActive Control eXperts, Inc. · 2000
- Packaged strain actuator58US 5,656,882 AActive Control eXperts, Inc. · 1997
- Method for encapsulating a ceramic device for embedding in composite structures56US 5,305,507 ATRW Inc. · 1994
- Method for manufacturing a disk drive microactuator that includes a piezoelectric element and a peripheral encapsulation layer46US 8,756,776 B1Western Digital Technologies, Inc. · 2014