H10H 20/8504
Chip-scale type packages
Official title: {Chip-scale type packages}
H10H20/8504 (Chip-scale type packages) appears on 11 US grants and 42 published applications in this corpus.
Search patents in H10H- Granted patents
- 11
- Published applications
- 42
- Assignees
- 24
- Inventors
- 126
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2015 | 0 | 2 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 1 | 2 |
| 2022 | 0 | 2 |
| 2023 | 2 | 3 |
| 2024 | 1 | 3 |
| 2025 | 3 | 17 |
| 2026 | 2 | 11 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Light-emitting device including light-transmissive member disposed above wavelength conversion member via air layer30 Jun 2026US 12,669,233 B2Nichia Corporation
- On-chip integration of optical components with photonic wire bonds and/or lenses16 Jun 2026US 12,658,668 B2The University of British Columbia
- Chip-scale package light emitting diode9 Sep 2025US 12,414,422 B2Seoul Viosys Co., Ltd.
- Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof10 Jun 2025US 12,328,928 B2Oki Electric Industry Co., Ltd.
- Light-emitting unit1 Apr 2025US 12,266,743 B2Innolux Corporation
- Optoelectronic component and method of producing an optoelectronic component1 Oct 2026US 2026/0305026 A1ams-OSRAM International GmbH
- Led packaging structure and light emitting assembly10 Sep 2026US 2026/0271448 A1Advanced Optoelectronic Technology, Inc.
- Light-emitting device, display apparatus, and backlight apparatus27 Aug 2026US 2026/0255741 A1BOE MLED Technology Co., Ltd.
- Cover structures with cutouts away from edges for wirebonding30 Jul 2026US 2026/0223499 A1CreeLED, Inc.
- Led package with side coating and method of manufacture25 Jun 2026US 2026/0182119 A1Lumileds LLC
Most cited
By later US patents