Cover structures with cutouts away from edges for wirebonding

Abstract

Light-emitting diode (LED) components and, more particularly, cover structures for LED components are disclosed. The cover structures have cut-outs for bond pads that are away from the edges of the cover structure and methods for fabricating the cover structures for the LED components. The cut-outs in the cover structure are enclosed by the non-cut-out portions of the cover structure i.e., the cut-out portions do not form an outer edge of the cover structure. This can maximize the coverage of the cover structure over the LED chip as well as make it easier to handle the cover structure. Additionally, cut-out portions can be formed in the cover structure prior to attaching and/or mounting the cover structure to the LED package, thus simplifying the fabrication process and avoiding the time consuming and wasteful exercise of grinding the cover structure to expose the bond pad after the LED chip is bump bonded.

Dependencies are inferred from the claim text.