Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof

A semiconductor packaging circuit comprising:

• a semiconductor element unit, including:
• a semiconductor element, and
• a first electrode having a flat first electrode mounting surface and a bonding surface opposite to the first electrode mounting surface, a roughness of the first electrode mounting surface being less than or equal to 10 [nm], the bonding surface of the first electrode forming eutectic bonding with the semiconductor element, and being in ohmic contact with the semiconductor element;
• a circuit board having a substrate surface that is formed flat;
• a first circuit connection pad provided on the circuit board, and having a first pad surface that is exposed to the substrate surface and is in contact with the first electrode mounting surface of the semiconductor element unit;
• a second circuit connection pad provided on the circuit board and having a second pad surface that is exposed to the substrate surface;
• an insulation part formed on a region extending from a part of the semiconductor element to a part of the second circuit connection pad via the circuit board;
• and
• a wiring part formed to be overlaid on the insulation part and electrically connecting another part of the semiconductor element not covered by the insulation part and the second circuit connection pad to each other.

A method of manufacturing a semiconductor packaging circuit, comprising:

• providing
• a circuit board having a substrate surface,
• a first circuit connection pad provided on the circuit board and having a first pad surface that is exposed to the substrate surface, and
• a second circuit connection pad provided on the circuit board and having a second pad surface that is exposed to the substrate surface;
• transferring a semiconductor element unit having
• a semiconductor element, and
• a first electrode having a flat first electrode mounting surface and a bonding surface opposite to the first electrode mounting surface, a roughness of the first electrode mounting surface being less than or equal to 10 [nm], the bonding surface of the first electrode forming eutectic bonding with the semiconductor element, and being in ohmic contact with the semiconductor element onto the substrate surface of the circuit board and placing the first electrode mounting surface in contact with the first pad surface;
• forming a first insulation part on a region extending from a part of the semiconductor element to a part of the second circuit connection pad via the circuit board;
• and
• forming a wiring part that electrically connects another part of the semiconductor element not covered by the first insulation part and another part of the second circuit connection pad not covered by the first insulation part to each other so that the wiring part is overlaid on the first insulation part.