Optoelectronic component and method of producing an optoelectronic component

An optoelectronic component comprising:

• a carrier with a main surface, the carrier comprising a ceramic;
• an optoelectronic semiconductor chip arranged on the main surface of the carrier;
• and
• a frame laterally at least partially enclosing the carrier,
• wherein at least the main surface of the carrier comprises a metallic coating,
• wherein an area of the carrier directly in contact with the frame is partially free of the metallic coating, and
• wherein the metallic coating has a thickness between 10 nanometers and 10 micrometers, inclusive.

A method for producing an optoelectronic component, the method comprising:

• providing a carrier with a main surface;
• applying a metallic coating to at least the main surface of the carrier;
• etching the carrier with the metallic coating applied thereto such that the carrier is at least partially free of the metallic coating after etching;
• forming a frame laterally at least partially enclosing the carrier;
• and
• applying an optoelectronic semiconductor chip to the main surface of the carrier,
• wherein an area of the carrier which is in direct contact with the frame is partially free of the metallic coating, and
• wherein an etching mask is applied to the metallic coating before etching.