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US 10,985,206 B2Granted
Chip-scale package light emitting diode
AssigneeSeoul Viosys Co., Ltd.
InventorsSe Hee Oh, Jong Kyu Kim, Joon Sub Lee
Life of this patent
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Abstract
A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
Claims9
A light emitting diode, comprising:
- a substrate;
- a first conductivity type semiconductor layer disposed on the substrate;
- a mesa disposed on the first conductivity type semiconductor layer, the mesa comprising an active layer and a second conductivity type semiconductor layer;
- an ohmic reflection layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
- a lower insulation layer covering the mesa and the ohmic reflection layer, the lower insulation layer comprising a first opening exposing the first conductivity type semiconductor layer and a second opening exposing the ohmic reflection layer;
- a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer through the first opening;
- a second pad metal layer disposed on the lower insulation layer, and electrically connected to the ohmic reflection layer through the second opening;
- an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening exposing the first pad metal layer and a second opening exposing the second pad metal layer;
- and
- first and second pump pads that cover the first and second pad metal layers exposed through the first and second openings of the upper insulation layer, respectively,
- wherein the second opening of the upper insulation layer is separated from the second opening of the lower insulation layer,
- wherein the second pad metal layer has a portion formed as a first groove in a plan view,
- wherein the first opening of the lower insulation layer is disposed on a first side of the first groove and the second opening of the lower insulation layer is disposed on a second side of the first groove,
- wherein the second bump pad has a portion formed as a second groove in the plan view, and
- wherein the first groove corresponds with the second groove.
12 more elements
A light emitting diode, comprising:
- a substrate;
- a first conductivity type semiconductor layer disposed on the substrate;
- a mesa disposed on the first conductivity type semiconductor layer, the mesa comprising an active layer and a second conductivity type semiconductor layer;
- an ohmic reflection layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
- a lower insulation layer covering the mesa and the ohmic reflection layer, the lower insulation layer comprising a first opening exposing the first conductivity type semiconductor layer and a second opening exposing the ohmic reflection layer;
- a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer through the first opening;
- a second pad metal layer disposed on the lower insulation layer, and electrically connected to the ohmic reflection layer through the second opening;
- and
- an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening exposing the first pad metal layer and a second opening exposing the second pad metal layer,
- wherein the second opening of the upper insulation layer is separated from the second opening of the lower insulation layer, and wherein the first and second pad metal layers exposed through the first and second openings of the upper insulation layer are bonding pads to which a solder is directly bonded.
7 more elements
Dependencies are inferred from the claim text.