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US 12,414,422 B2Granted
Chip-scale package light emitting diode
AssigneeSeoul Viosys Co., Ltd.
InventorsSe Hee Oh, Jong Kyu Kim, Joon Sub Lee
Life of this patent
Estimating the term…
Abstract
A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
Claims20
A light apparatus, comprising:
- a substrate including a conductive pattern;
- a light source disposed on the substrate and electrically connected to the conductive pattern, the light source including:
- a first conductivity type semiconductor layer;
- a mesa disposed on the first conductivity type semiconductor layer, the mesa comprising an active layer and a second conductivity type semiconductor layer;
- an ohmic layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
- a lower insulation layer disposed on the ohmic layer and including a first material and a second material;
- a preliminary layer disposed between the ohmic layer and the lower insulation layer;
- a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer;
- a second pad metal layer disposed on the lower insulation layer, and electrically connected to the ohmic layer;
- an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening configured to expose the first pad metal layer and a second opening configured to expose the second pad metal layer;
- a first bump pad connected to the first pad metal layer through the first opening of the upper insulation layer;
- and
- a second bump pad connected to the second pad metal layer through the second opening of the upper insulation layer;
- and
- a light transmissive layer disposed on the light source,
- wherein the lower insulation layer has a plurality of refractive indices, and the upper insulation layer covers a side surface of the preliminary layer and the first material of the lower insulation layer.
13 more elements
A light apparatus, comprising:
- a substrate including a conductive pattern;
- a light source disposed on the substrate and electrically connected to the conductive pattern, the light source including:
- a first conductivity type semiconductor layer;
- a mesa disposed on the first conductivity type semiconductor layer, the mesa comprising an active layer and a second conductivity type semiconductor layer;
- an ohmic layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
- a lower insulation layer disposed on the ohmic layer;
- a preliminary layer disposed between the ohmic layer and the lower insulation layer;
- a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer;
- a second pad metal layer disposed on the lower insulation layer, and electrically connected to the ohmic layer;
- an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening configured to expose the first pad metal layer and a second opening configured to expose the second pad metal layer;
- a first bump pad connected to the first pad metal layer through the first opening of the upper insulation layer;
- and
- a second bump pad connected to the second pad metal layer through the second opening of the upper insulation layer;
- and
- a light transmissive layer disposed on the light source,
- wherein the lower insulation layer includes a first material and a second material, and the preliminary layer and the upper insulation layer include a material identical to the first material.
13 more elements
A light apparatus, comprising:
- a substrate including a conductive pattern;
- a light source disposed on the substrate and electrically connected to the conductive pattern, the light source including:
- a first conductivity type semiconductor layer;
- a mesa disposed on the first conductivity type semiconductor layer, the mesa comprising an active layer and a second conductivity type semiconductor layer;
- an ohmic layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
- a lower insulation layer disposed on the ohmic layer and including a first material and a second material;
- a preliminary layer is disposed between the ohmic layer and the lower insulation layer;
- a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer;
- a second pad metal layer disposed on the lower insulation layer, and electrically connected to the ohmic layer;
- an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening configured to expose the first pad metal layer and a second opening configured to expose the second pad metal layer;
- a first bump pad connected to the first pad metal layer through the first opening of the upper insulation layer;
- and
- a second bump pad connected to the second pad metal layer through the second opening of the upper insulation layer;
- and
- a light transmissive layer disposed on the light source;
- wherein the lower insulation layer has a reflectivity and a plurality of refractive indices, and the preliminary layer and the upper insulation layer include a material identical to the first material.
13 more elements
Dependencies are inferred from the claim text.