H10F 39/804
Containers or encapsulations
Official title: {Containers or encapsulations}
H10F39/804 (Containers or encapsulations) appears on 3,613 US grants and 4,733 published applications in this corpus.
Search patents in H10F- Granted patents
- 3,613
- Published applications
- 4,733
- Assignees
- 835
- Inventors
- 5,659
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 11 | 0 |
| 1999 | 10 | 0 |
| 2000 | 13 | 0 |
| 2001 | 26 | 19 |
| 2002 | 43 | 64 |
| 2003 | 65 | 66 |
| 2004 | 65 | 124 |
| 2005 | 64 | 200 |
| 2006 | 90 | 235 |
| 2007 | 105 | 232 |
| 2008 | 129 | 247 |
| 2009 | 151 | 235 |
| 2010 | 172 | 222 |
| 2011 | 165 | 195 |
| 2012 | 144 | 176 |
| 2013 | 145 | 179 |
| 2014 | 192 | 216 |
| 2015 | 186 | 185 |
| 2016 | 182 | 198 |
| 2017 | 186 | 199 |
| 2018 | 172 | 228 |
| 2019 | 213 | 266 |
| 2020 | 225 | 226 |
| 2021 | 159 | 230 |
| 2022 | 144 | 164 |
| 2023 | 149 | 156 |
| 2024 | 156 | 202 |
| 2025 | 123 | 145 |
| 2026 | 77 | 124 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Organic substrate for placing components of a camera6 Oct 2026US 12,756,912 B1Apple Inc.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Semiconductor device and electronic device22 Sep 2026US 12,744,305 B2Sony Semiconductor Solutions Corporation
- Image sensor and packaging thereof15 Sep 2026US 12,740,168 B2Powertech Technology Inc.
- Semiconductor chip and manufacturing method therefor, semiconductor device and manufacturing method therefor, and electronic device15 Sep 2026US 12,740,169 B2Sony Semiconductor Solutions Corporation
- Radiographic imaging device1 Oct 2026US 2026/0299147 A1Hamamatsu Photonics K.K.
- Stacked devices and methods of fabrication1 Oct 2026US 2026/0305491 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor device structure and method for forming the same24 Sep 2026US 2026/0293170 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages with reliable covers24 Sep 2026US 2026/0293340 A1UTAC Headquarters Pte. Ltd.
- Optical package with stacked integrated filters24 Sep 2026US 2026/0293341 A1
Most cited
By later US patents
- Apparatus for multiple camera devices and method of operating same466US 7,199,348 B2Newport Imaging Corporation · 2007
- Leadless image sensor package structure and method for making the same353US 6,384,472 B1Siliconware Precision Industries Co., Ltd. · 2002
- Image sensor of a quad flat package347US 6,545,332 B2Siliconware Precision Industries Co., Ltd. · 2003
- Bi-level microelectronic device package with an integral window296US 6,674,159 B1Sandia National Laboratories · 2004
- Digital camera with integrated infrared (IR) response277US 7,566,855 B22009