Semiconductor device and electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorsTakahiro Igarashi, Shuichi Oka, Shun Mitarai
Life of this patent
Estimating the term…
Abstract
The present invention relates to a semiconductor device and an electronic device that facilitate calibration and can obtain favorable characteristics. The semiconductor device includes a substrate, a millimeter wave antenna provided on the substrate, and an image sensor provided on the substrate, in which an antenna surface of the millimeter wave antenna and a light receiving surface of the image sensor are disposed at spatially partitioned positions. The present technology can be applied to a sensor module.
Claims14
A semiconductor device, comprising:
- a substrate;
- a module including a millimeter wave antenna provided on the substrate;
- an image sensor provided on the substrate,
- wherein an antenna surface of the millimeter wave antenna and a light receiving surface of the image sensor are disposed at spatially partitioned positions,
- wherein the antenna surface is disposed at a position further away from the substrate than the image sensor in a direction perpendicular to the substrate;
- and
- a bottom-raising substrate that is disposed between the substrate and the module, wherein the bottom-raising substrate has a plurality of through holes formed therein, and
- wherein each of a plurality of the through holes is a through hole for transmission of an input signal to the module, for transmission of an output signal from the module, or for power supply.
An electronic device including a semiconductor device, wherein
- the semiconductor device comprises
- a substrate,
- a module including a millimeter wave antenna provided on the substrate, and
- an image sensor provided on the substrate,
- and
- wherein an antenna surface of the millimeter wave antenna and a light receiving surface of the image sensor are disposed at spatially partitioned positions,
- wherein the antenna surface is disposed at a position further away from the substrate than the image sensor in a direction perpendicular to the substrate;
- and
- a bottom-raising substrate that is disposed between the substrate and the module,
- wherein the bottom-raising substrate has a plurality of through holes formed therein, and
- wherein each of a plurality of the through holes is a through hole for transmission of an input signal to the module, for transmission of an output signal from the module, or for power supply.
Dependencies are inferred from the claim text.