Semiconductor packages with reliable covers
AssigneeUTAC Headquarters Pte. Ltd.
InventorsIl Kwon SHIM, Jeffrey PUNZALAN
Life of this patent
Estimating the term…
Abstract
A semiconductor package is disclosed. The package includes a sensor die which is disposed on a package substrate. A cover structure is attached to a cover adhesive surrounding the sensor die, forming a cavity above the sensor die. The cover structure includes a primary cover structure and a secondary cover structure surrounding the primary cover structure. The secondary cover structure is configured to protect the primary cover structure from damage during packaging. The package also includes an encapsulant. The encapsulant covers side surfaces of the cover structure, sides of the cover adhesive, and exposed portions of the package substrate, leaving the first major cover surface exposed.
Claims20
A method for forming integrated cover structures for semiconductor packages comprising:
- providing a cover support, the cover support comprises a processing surface on which a plurality of cover structures are formed in parallel;
- applying a double-sided adhesive tape on the processing surface;
- providing a plurality of primary cover structures, wherein the primary cover structures are configured for transmitting radiation to sensors of sensor chips of sensor semiconductor packages, the primary cover structure comprises first and second primary surfaces and primary side surfaces;
- attaching the plurality of primary cover structures on the processing surface, wherein the adhesive tape facilitates maintaining positions of the primary cover structures on the processing surface;
- molding the plurality of primary cover structures with mold compound to form a molded cover sheet;
- and
- singulating the molded cover sheet into a plurality of cover structures.
A method for forming a semiconductor package comprising:
- providing a package substrate having top and bottom major package substrate surfaces, wherein the top major package substrate surface includes a die region;
- providing a die having first and major die surfaces, wherein the first major die surface includes a sensor region with a sensor cover adhesive region surrounding the sensor region;
- providing a cover structure unit, the cover structure unit includes
- a primary cover structure, the primary cover structure includes top and bottom major primary cover structure surfaces and side primary cover structure surfaces,
- a secondary cover structure surrounding the primary cover structure and in direct contact with at least the side primary cover structure surfaces, the secondary cover structure is configured to protect the primary cover structure from damage during packaging to form the semiconductor package, and
- a cover bond region on a bottom cover structure unit surface;
- attaching the second major die surface to the die region on the top major package substrate surface;
- forming a cover adhesive on the cover adhesive region on the first major die surface;
- attaching the cover bond region of the cover structure unit to the cover adhesive, wherein the cover adhesive and cover structure unit form a sealed cavity between the cover structure unit and the sensor region;
- and
- forming an encapsulant, the encapsulant covers exposed portions of the package substrate, the die and bond wires and at least a portion of the side cover structure unit surfaces while leaving the top major cover structure unit surface exposed.
Dependencies are inferred from the claim text.