Semiconductor chip and manufacturing method therefor, semiconductor device and manufacturing method therefor, and electronic device

A method of manufacturing a semiconductor chip, the method comprising:

• forming an imaging element;
• forming a sealing resin including a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material on the imaging element, wherein the reinforcing material is fibrous, and
• wherein, in the reinforcing material, a diameter of a cross section of a short side is shorter than a wavelength of visible light, and a diameter of a cross section of a long side is three times or more a cross-sectional diameter of the short side;
• and
• bonding a protective substrate to the imaging element via the sealing resin.

A semiconductor device, comprising:

• a semiconductor chip including:
• an imaging element;
• a sealing resin formed on the imaging element;
• and
• a protective substrate bonded to the imaging element via the sealing resin,
• the sealing resin including a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material, wherein the reinforcing material is fibrous, and wherein, in the reinforcing material, a diameter of a cross section of a short side is shorter than a wavelength of visible light, and a diameter of a cross section of a long side is three times or more a cross-sectional diameter of the short side;
• a substrate on which the semiconductor chip is mounted;
• and
• an underfill material formed on the substrate to cover a side surface of the semiconductor chip.

A method of manufacturing a semiconductor device, the method comprising:

• forming a semiconductor chip by:
• forming an imaging element;
• forming a sealing resin including a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material on the imaging element, wherein the reinforcing material is fibrous, and wherein, in the reinforcing material, a diameter of a cross section of a short side is shorter than a wavelength of visible light, and a diameter of a cross section of a long side is three times or more a cross-sectional diameter of the short side;
• and
• bonding a protective substrate to the imaging element via the sealing resin;
• mounting the semiconductor chip on a substrate;
• and
• charging an underfill material from a periphery of the semiconductor chip between the semiconductor chip and the substrate and thermally curing the underfill material, and covering a side surface of the semiconductor chip with the underfill material.

A semiconductor device, comprising:

• a semiconductor chip including:
• an imaging element;
• a sealing resin formed on the imaging element;
• and
• a protective substrate bonded to the imaging element via the sealing resin,
• the sealing resin including a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material, wherein the reinforcing material is fibrous, and wherein, in the reinforcing material, a diameter of a cross section of a short side is shorter than a wavelength of visible light, and a diameter of a cross section of a long side is three times or more a cross-sectional diameter of the short side;
• a substrate on which the semiconductor chip is mounted using a wire;
• and
• a resin formed on the substrate to cover the wire on a side surface of the semiconductor chip.

An electronic device, comprising:

• a semiconductor chip including:
• an imaging element;
• a sealing resin formed on the imaging element;
• and
• a protective substrate bonded to the imaging element via the sealing resin,
• the sealing resin including a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material, wherein the reinforcing material is fibrous, and wherein, in the reinforcing material, a diameter of a cross section of a short side is shorter than a wavelength of visible light, and a diameter of a cross section of a long side is three times or more a cross-sectional diameter of the short side;
• and
• a signal processing circuit that processes a signal from the semiconductor chip.