H10F 39/8037
The integrated elements comprising a transistor
Official title: {the integrated elements comprising a transistor}
H10F39/8037 (The integrated elements comprising a transistor) appears on 4,558 US grants and 5,645 published applications in this corpus.
Search patents in H10F- Granted patents
- 4,558
- Published applications
- 5,645
- Assignees
- 505
- Inventors
- 4,532
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 10 | 0 |
| 2000 | 6 | 0 |
| 2001 | 13 | 12 |
| 2002 | 21 | 12 |
| 2003 | 15 | 12 |
| 2004 | 10 | 22 |
| 2005 | 16 | 49 |
| 2006 | 23 | 45 |
| 2007 | 30 | 37 |
| 2008 | 29 | 34 |
| 2009 | 27 | 45 |
| 2010 | 40 | 80 |
| 2011 | 43 | 104 |
| 2012 | 58 | 98 |
| 2013 | 91 | 166 |
| 2014 | 165 | 212 |
| 2015 | 207 | 336 |
| 2016 | 314 | 416 |
| 2017 | 368 | 407 |
| 2018 | 386 | 353 |
| 2019 | 331 | 382 |
| 2020 | 370 | 476 |
| 2021 | 332 | 504 |
| 2022 | 358 | 456 |
| 2023 | 338 | 435 |
| 2024 | 395 | 407 |
| 2025 | 330 | 329 |
| 2026 | 209 | 216 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sensing device, and method of manufacturing the same6 Oct 2026US 12,757,508 B2Innolux Corporation
- Image sensors including conductive pixel separation structures6 Oct 2026US RE51,061 E1Samsung Electronics Co., Ltd.
- Image sensor and driving method thereof29 Sep 2026US 12,750,605 B2Samsung Electronics Co., Ltd.
- Image sensor29 Sep 2026US 12,751,099 B2Samsung Electronics Co., Ltd.
- Layout for imaging system and pixel cell array with quad row select transistors22 Sep 2026US 12,745,014 B1OmniVision Technologies, Inc.
- Image sensing device and methods of manufacturing the same8 Oct 2026US 2026/0314089 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Photodetection device and electronic apparatus8 Oct 2026US 2026/0314090 A1Sony Semiconductor Solutions Corporation
- Image sensor8 Oct 2026US 2026/0314091 A1Samsung Electronics Co., Ltd.
- Image sensor with shared gate architecture for metal layer reduction8 Oct 2026US 2026/0314092 A1OmniVision Technologies, Inc.
- Image sensor8 Oct 2026US 2026/0314093 A1Postech Research and Business Development Foundation
Most cited
By later US patents
- Three-dimensional integrated circuit device and its manufacturing method469US 5,998,808 ASony Corporation · 1999
- Vertically stacked image sensor284US 8,773,562 B1Apple Inc. · 2014
- Method and apparatus for image sensor packaging244US 9,337,235 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- CMOS imager with a self-aligned buried contact208US 6,326,652 B1Micron Technology, Inc. · 2001
- Methods and devices for charge management for three-dimensional sensing193US 6,906,793 B2Canesta, Inc. · 2005