H10D 84/962
Horizontal or vertical grid line density
Official title: {Horizontal or vertical grid line density}
H10D84/962 (Horizontal or vertical grid line density) appears on 100 US grants and 111 published applications in this corpus.
Search patents in H10D- Granted patents
- 100
- Published applications
- 111
- Assignees
- 8
- Inventors
- 56
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 58 |
| 2011 | 16 | 0 |
| 2012 | 41 | 0 |
| 2013 | 1 | 8 |
| 2014 | 3 | 0 |
| 2015 | 3 | 2 |
| 2016 | 3 | 3 |
| 2017 | 0 | 5 |
| 2018 | 3 | 3 |
| 2019 | 3 | 7 |
| 2020 | 5 | 1 |
| 2021 | 3 | 7 |
| 2022 | 3 | 5 |
| 2023 | 3 | 4 |
| 2024 | 3 | 2 |
| 2025 | 6 | 3 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit3 Mar 2026US 12,568,685 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure having different heights of active regions27 Jan 2026US 12,538,580 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit device with improved layout27 May 2025US 12,315,862 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Power rail and signal conducting line arrangement27 May 2025US 12,317,589 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor integrated circuit device having standard cells including three dimensional transistors20 May 2025US 12,310,103 B2Socionext Inc.
- Integrated circuit4 Jun 2026US 2026/0156934 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit device with improved layout13 Nov 2025US 2025/0351572 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Power rail and signal conducting line arrangement4 Sep 2025US 2025/0280600 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit21 Aug 2025US 2025/0267936 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Power rail and signal conducting line arrangement15 Aug 2024US 2024/0274607 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Dynamic array architecture227US 7,446,352 B2Tela Innovations, Inc. · 2008
- Integrated circuit having gate electrode level region including at least four linear-shaped conductive structures with some outer-contacted linear-shaped conductive structures having larger outer extending portion than inner extending portion159US 8,134,184 B2Tela Innovations, Inc. · 2012
- Dynamic array architecture142US 7,842,975 B2Tela Innovations, Inc. · 2010
- Semiconductor device having at least three linear-shaped electrode level conductive features of equal length positioned side-by-side at equal pitch141US 8,058,671 B2Tela Innovations, Inc. · 2011
- Semiconductor device and associated layouts having transistors formed from linear conductive segment with non-active neighboring linear conductive segment140US 7,910,958 B2Tela Innovations, Inc. · 2011