Power rail and signal conducting line arrangement

A method comprising:

• fabricating a first semiconductor structure extending in a first direction;
• fabricating a first terminal-conductor intersecting the first semiconductor structure;
• fabricating a gate-conductor extending in a second direction and intersecting the first semiconductor structure at a channel region, the second direction being perpendicular to the first direction;
• fabricating a first-voltage underlayer power rail extending in the first direction which is conductively connected to the first terminal-conductor;
• depositing an insulating material covering the first-voltage underlayer power rail;
• fabricating a first via-connector and a gate via-connector each passing through the insulating material;
• depositing a metal over the insulating material to form a first connection layer;
• and
• patterning the first connection layer to form a first-voltage power rail extending in the second direction and a first signal conducting line extending in the second direction, wherein the first-voltage power rail is directly connected with the first-voltage underlayer power rail through the first via-connector, and wherein the first signal conducting line is directly connected with the gate-conductor through the gate via-connector.

A method comprising:

• fabricating a first semiconductor structure extending in a first direction;
• fabricating a first terminal-conductor intersecting the first semiconductor structure;
• fabricating a drain terminal-conductor extending in a second direction and intersecting the first semiconductor structure at a drain region, the second direction being perpendicular to the first direction;
• fabricating a first-voltage underlayer power rail extending in the first direction which is conductively connected to the first terminal-conductor;
• depositing an insulating material covering the first-voltage underlayer power rail;
• fabricating a first via-connector and a terminal via-connector each passing through the insulating material;
• depositing a metal over the insulating material to form a first connection layer;
• and
• patterning the first connection layer to form a first-voltage power rail extending in the second direction and a first signal conducting line extending in the second direction, wherein the first-voltage power rail is directly connected with the first-voltage underlayer power rail through the first via-connector, and wherein the first signal conducting line is directly connected with the drain terminal-conductor through the terminal via-connector.