H10D 1/476
Comprising conducting organic materials
Official title: {comprising conducting organic materials, e.g. conducting polymers}
H10D1/476 (Comprising conducting organic materials) appears on 20 US grants and 20 published applications in this corpus.
Search patents in H10D- Granted patents
- 20
- Published applications
- 20
- Assignees
- 14
- Inventors
- 30
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 0 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 1 | 0 |
| 2014 | 1 | 2 |
| 2015 | 1 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 3 |
| 2019 | 4 | 4 |
| 2020 | 2 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 1 | 1 |
| 2024 | 0 | 0 |
| 2025 | 2 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heterogeneous annealing method and device28 Jul 2026US 12,696,818 B2Adeia Semiconductor Bonding Technologies Inc.
- Heterogeneous annealing method and device7 Oct 2025US 12,438,129 B2Adela Semiconductor Bonding Technologies Inc.
- Heterogeneous annealing method and device14 Jan 2025US 12,199,069 B2Adeia Semiconductor Bonding Technologies Inc.
- Heterogeneous annealing method18 Apr 2023US 11,631,586 B2Adeia Semiconductor Bonding Technologies Inc.
- Patterning sheet and etched structure production method11 Jan 2022US 11,222,787 B2Kaneka Corporation
- Heterogeneous annealing method and device14 May 2026US 2026/0137000 A1Adeia Semiconductor Bonding Technologies Inc.
- Resistor structure and manufacturing method thereof7 May 2026US 2026/0129883 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heterogeneous annealing method and device8 May 2025US 2025/0149510 A1Adeia Semiconductor Bonding Technologies Inc.
- Heterogeneous annealing method and device29 Jun 2023US 2023/0207322 A1Adeia Semiconductor Bonding Technologies Inc.
- Heterogeneous annealing method and device15 Oct 2020US 2020/0328193 A1Invensas Bonding Technologies, Inc.
Most cited
By later US patents
- Heterogeneous annealing method and device223US 9,184,125 B2Ziptronix, Inc. · 2015
- Programmable resistive RAM and manufacturing method43US 7,560,337 B2Macronix International Co., Ltd. · 2009
- Heterogeneous annealing method and device12US 8,735,219 B2Ziptronix, Inc. · 2014
- Method for controlling the conductivity of polyimide films and improved devices utilizing the method8US 4,393,092 AMotorola, Inc. · 1983
- Heterogeneous annealing method and device8US 9,698,126 B2Ziptronix, Inc. · 2017