H10B 69/00
Erasable-and-programmable rom [eprom] devices not provided for in groups h10b41/00 - h10b63/00
Official title: Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
H10B69/00 (Erasable-and-programmable rom [eprom] devices not provided for in groups h10b41/00 - h10b63/00) appears on 7,319 US grants and 6,198 published applications in this corpus.
Search patents in H10B- Granted patents
- 7,319
- Published applications
- 6,198
- Assignees
- 642
- Inventors
- 5,835
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 6 | 0 |
| 1980 | 7 | 0 |
| 1981 | 9 | 0 |
| 1982 | 7 | 0 |
| 1983 | 12 | 0 |
| 1984 | 11 | 0 |
| 1985 | 11 | 0 |
| 1986 | 10 | 0 |
| 1987 | 15 | 0 |
| 1988 | 16 | 0 |
| 1989 | 30 | 0 |
| 1990 | 25 | 0 |
| 1991 | 78 | 0 |
| 1992 | 56 | 0 |
| 1993 | 64 | 0 |
| 1994 | 101 | 0 |
| 1995 | 110 | 0 |
| 1996 | 101 | 0 |
| 1997 | 140 | 0 |
| 1998 | 181 | 0 |
| 1999 | 199 | 0 |
| 2000 | 199 | 0 |
| 2001 | 271 | 98 |
| 2002 | 289 | 307 |
| 2003 | 335 | 366 |
| 2004 | 434 | 518 |
| 2005 | 385 | 667 |
| 2006 | 485 | 739 |
| 2007 | 455 | 801 |
| 2008 | 451 | 741 |
| 2009 | 470 | 448 |
| 2010 | 564 | 252 |
| 2011 | 393 | 215 |
| 2012 | 253 | 124 |
| 2013 | 185 | 93 |
| 2014 | 137 | 104 |
| 2015 | 119 | 90 |
| 2016 | 101 | 80 |
| 2017 | 91 | 84 |
| 2018 | 89 | 78 |
| 2019 | 80 | 93 |
| 2020 | 88 | 80 |
| 2021 | 64 | 61 |
| 2022 | 48 | 50 |
| 2023 | 49 | 40 |
| 2024 | 37 | 34 |
| 2025 | 32 | 24 |
| 2026 | 18 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- 3D cell and array structures22 Sep 2026US 12,744,086 B2NEO Semiconductor, Inc.
- In-situ carbon liner for high aspect ratio features1 Sep 2026US 12,727,409 B2APPLIED Materials.Inc.
- Semiconductor device including inverter circuit25 Aug 2026US 12,718,893 B2Kioxia Corporation
- Semiconductor device18 Aug 2026US 12,713,632 B2Samsung Electronics Co., Ltd.
- Method of forming expandable doped oxide films for advanced semiconductor applications18 Aug 2026US 12,713,887 B2Lam Research Corporation
- Array Of Capacitors, An Array Of Memory Cells, Method Used In Forming An Array Of Memory Cells, Methods Used In Forming An Array Of Capacitors, And Methods Used In Forming A Plurality Of Horizontally-Spaced Conductive Lines27 Aug 2026US 2026/0255683 A1Micron Technology, Inc.
- Method for forming semiconductor structure13 Aug 2026US 2026/0239615 A1Winbond Electronics Corp.
- 3d semiconductor device and structure with metal layers and a power delivery path13 Aug 2026US 2026/0239658 A1Monolithic 3D Inc.
- Semiconductor device6 Aug 2026US 2026/0229269 A1Semiconductor Energy Laboratory Co.Ltd.
- Memory cell, nonvolatile semiconductor storage device, and method for manufacturing nonvolatile semiconductor storage device6 Aug 2026US 2026/0231409 A1Floadia Corporation
Most cited
By later US patents
- Multi-state memory1,008US 6,222,762 B1SanDisk Corporation · 2001
- High density non-volatile flash memory without adverse effects of electric field coupling between adjacent floating gates827US 5,867,429 ASanDisk Corporation · 1999
- Highly compact EPROM and flash EEPROM devices819US 5,095,344 A1992
- Segmented column memory array801US 5,315,541 ASunDisk Corporation · 1994
- Electrically erasable phase change memory628US 5,166,758 AEnergy Conversion Devices, Inc. · 1992