H05K 7/20636
Within sub-racks for removing heat from electronic boards
Official title: {within sub-racks for removing heat from electronic boards}
H05K7/20636 (Within sub-racks for removing heat from electronic boards) appears on 145 US grants and 144 published applications in this corpus.
Search patents in H05K- Granted patents
- 145
- Published applications
- 144
- Assignees
- 96
- Inventors
- 377
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 2 |
| 2003 | 2 | 0 |
| 2004 | 0 | 0 |
| 2005 | 2 | 0 |
| 2006 | 0 | 0 |
| 2007 | 3 | 5 |
| 2008 | 2 | 2 |
| 2009 | 2 | 0 |
| 2010 | 0 | 2 |
| 2011 | 2 | 2 |
| 2012 | 1 | 2 |
| 2013 | 0 | 3 |
| 2014 | 4 | 4 |
| 2015 | 6 | 9 |
| 2016 | 12 | 10 |
| 2017 | 7 | 6 |
| 2018 | 7 | 6 |
| 2019 | 7 | 9 |
| 2020 | 8 | 12 |
| 2021 | 7 | 9 |
| 2022 | 7 | 8 |
| 2023 | 9 | 13 |
| 2024 | 9 | 18 |
| 2025 | 11 | 14 |
| 2026 | 8 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Smart rack liquid cooling manifold system having integrated controller(s) providing server-level liquid telemetry monitoring, rack liquid flow control, and datacenter communicaton25 Aug 2026US 12,720,714 B2Strategic Thermal Labs, LLC
- Cold plate placement and retraction apparatus with predefined travel pathway21 Jul 2026US 12,690,153 B2International Business Machines Corporation
- Sealed rack server cooling unit14 Jul 2026US 12,684,737 B2Nexalus Limited
- Heat dissipation apparatus, device, rack, and system12 May 2026US 12,628,312 B2Huawei Technologies Co., Ltd.
- Heat exchanger28 Apr 2026US 12,615,737 B2Aptiv Technologies AG
- Liquid cooling assembly for electronic components on printed circuit boards and computing device including same20 Aug 2026US 2026/0247571 A1Next Silicon Ltd
- Thermal management for an electrical component13 Aug 2026US 2026/0239562 A1TE Connectivity Solutions GmbH
- Heat dissipation device and electronic equipment having the same13 Aug 2026US 2026/0239573 A1Champ Tech Optical (Foshan) Corporation
- Liquid cooling of electronic components6 Aug 2026US 2026/0231375 A1Cisco Technology, Inc.
- Handle module and rack system30 Apr 2026US 2026/0122818 A1Wiwynn Corporation
Most cited
By later US patents
- Cold plate for cooling electronics110US 5,088,005 ASundstrand Corporation · 1992
- Cooling arrangement for plug-in module assembly103US 4,315,300 AThe United States of America as represented by the Secretary of the Navy · 1982
- Electronic packaging module utilizing phase-change conductive cooling95US 4,493,010 ALockheed Corporation · 1985
- Cold chassis for cooling electronic circuit components on an electronic board80US 4,962,444 ASunstrand Corporation · 1990
- Combination conductive and convective heatsink74US 5,424,916 AThe Charles Stark Draper Laboratory, Inc. · 1995