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US 4,315,300 AGranted
Cooling arrangement for plug-in module assembly
AssigneeThe United States of America as represented by the Secretary of the Navy
InventorsJames K. Parmerlee, B. Dale Tague
Life of this patent
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Abstract
An improved cooling arrangement for an electronic plug-in module assembly ving a plurality of modules supported in grooves in a pair of parallel sides. Each parallel side is provided with fluid passageways for carrying a cooling liquid for removing heat transferred from a heat sink on each module to the sides. A plurality of apertures are provided in each side between adjacent grooves and carry fins through which cool air is blown to cool each side of each plug-in module.
Claims5
A modular electronic system comprising,
- a support assembly having first and second side plates each having a plurality of spaced grooves therein,
- a plurality of electronic modules each having a metallic frame with the ends of each said metallic frame being slidably mounted in opposed grooves in said first and second side plates,
- a plurality of through slots in said first and second side plates, each said slot being positioned between adjacent grooves to provide air passages through said first and second side plates,
- means for circulating air through said plurality of slots thereby transferring heat from said electronic modules to said first and second side plates,
- a first longitudinal cooling passage in each said side plate positioned above said through slots and behind said spaced grooves and a second longitudinal cooling passage in each said side plate positioned below said through slots and behind said spaced grooves, and
- means for circulating cooling liquid through said passages.
3 more elements
Dependencies are inferred from the claim text.