H05K 7/20627
Liquid coolant without phase change
Official title: {Liquid coolant without phase change}
H05K7/20627 (Liquid coolant without phase change) appears on 268 US grants and 293 published applications in this corpus.
Search patents in H05K- Granted patents
- 268
- Published applications
- 293
- Assignees
- 171
- Inventors
- 695
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 2 |
| 2003 | 2 | 2 |
| 2004 | 0 | 0 |
| 2005 | 2 | 2 |
| 2006 | 2 | 2 |
| 2007 | 3 | 8 |
| 2008 | 4 | 10 |
| 2009 | 5 | 2 |
| 2010 | 6 | 6 |
| 2011 | 8 | 10 |
| 2012 | 4 | 6 |
| 2013 | 5 | 14 |
| 2014 | 8 | 9 |
| 2015 | 10 | 12 |
| 2016 | 19 | 14 |
| 2017 | 9 | 10 |
| 2018 | 11 | 12 |
| 2019 | 15 | 15 |
| 2020 | 15 | 20 |
| 2021 | 14 | 21 |
| 2022 | 16 | 9 |
| 2023 | 16 | 27 |
| 2024 | 17 | 31 |
| 2025 | 19 | 27 |
| 2026 | 14 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Smart rack liquid cooling manifold system having integrated controller(s) providing server-level liquid telemetry monitoring, rack liquid flow control, and datacenter communicaton25 Aug 2026US 12,720,714 B2Strategic Thermal Labs, LLC
- Cold plate placement and retraction apparatus with predefined travel pathway21 Jul 2026US 12,690,153 B2International Business Machines Corporation
- Busbar cable adapter14 Jul 2026US 12,683,315 B2Dell Products L. P.
- Sealed rack server cooling unit14 Jul 2026US 12,684,737 B2Nexalus Limited
- Housing for immersive liquid cooling of multiple electronic devices26 May 2026US 12,641,748 B2Iceotope Group Limited
- Housing for immersive liquid cooling of multiple electronic devices24 Sep 2026US 2026/0293040 A1Iceotope Group Limited
- Vapor chamber for data center cooling10 Sep 2026US 2026/0271239 A1NVIDIA Corporation
- Liquid cooling assembly for electronic components on printed circuit boards and computing device including same20 Aug 2026US 2026/0247571 A1Next Silicon Ltd
- Automated cooling requirement determination for computing environments20 Aug 2026US 2026/0247579 A1NVIDIA Corporation
- Thermal management for an electrical component13 Aug 2026US 2026/0239562 A1TE Connectivity Solutions GmbH
Most cited
By later US patents
- Electronic apparatus and method of cooling the same157US 5,323,847 AHitachi, Ltd. · 1994
- Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack129US 7,086,247 B2International Business Machines Corporation · 2006
- Cold plate for cooling electronics110US 5,088,005 ASundstrand Corporation · 1992
- Cooling arrangement for plug-in module assembly103US 4,315,300 AThe United States of America as represented by the Secretary of the Navy · 1982
- Electronic packaging module utilizing phase-change conductive cooling95US 4,493,010 ALockheed Corporation · 1985