Housing for immersive liquid cooling of multiple electronic devices

A module for cooling electronic devices using a liquid coolant, comprising:

• an enclosure within the module, for receiving and containing the liquid coolant;
• a pump and a heat exchanger, both located within the enclosure, the heat exchanger being arranged to receive the liquid coolant as a primary liquid coolant, to receive a secondary liquid coolant and to transfer heat from the primary liquid coolant to the secondary liquid coolant;
• and
• a housing mounted within the enclosure, wherein the housing is a first sub-housing of a plurality of sub-housings arranged in a sequence, each other sub-housing of the plurality of sub-housings being formed by a respective other housing that comprises:
• a wall structure, arranged to define a plurality of mounting chambers, each mounting chamber being configured to hold at least one respective electronic device and having a respective chamber coolant inlet for receiving the liquid coolant, such that the liquid coolant received through each chamber coolant inlet accumulates in the respective mounting chamber around the respective electronic device;
• a housing coolant inlet, for receiving the liquid coolant from outside the housing, the pump being arranged to cause the liquid coolant to flow to the housing cooling inlet;
• and
• a liquid coolant manifold, arranged to receive the liquid coolant from the housing coolant inlet and provide the liquid coolant to each of the chamber coolant inlets,
• wherein each sub-housing includes a seal disposed between the liquid coolant manifold of that sub-housing, and the liquid coolant manifold of the next sub-housing in the sequence.