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US 2026/0271239 A1Published application
Vapor chamber for data center cooling
AssigneeNVIDIA Corporation
InventorsJohn Franz, Tahir Cader, David Haley, Matthew Slaby, Elad Mentovich
Life of this patent
Estimating the term…
Abstract
Cold plate embodiments utilizing a vapor chamber formed with a vapor conduit and top and bottom heat exchangers that direct coolant across surfaces of the vapor chamber to conduct heat away from a device to cool, such as an integrated circuit. The cold plate may receive pumped coolant via multiple low-profile inlet ports, and the coolant may exit the cold plate via multiple low-profile outlet ports.
Claims20
A cooling apparatus comprising:
- a vapor chamber comprising a lower portion, and upper portion, and a vapor conduit configured to enable a convection flow of vapor from the lower portion to the upper portion;
- a first heat exchanger thermally coupled to the lower portion of the vapor chamber;
- and
- a second heat exchanger thermally coupled to the upper portion of the vapor chamber.
1 more element
An assembly comprising:
- a data processor;
- a cooling apparatus in thermal contact with the data processor, the cooling apparatus comprising:
- a vapor chamber comprising a plurality of portions;
- at least one vapor conduit configured to enable a convection flow of vapor from the lower portion to the upper portion;
- a first heat exchanger thermally coupled to the lower portion of the vapor chamber;
- and
- a second heat exchanger thermally coupled to the upper portion of the vapor chamber.
4 more elements
A data center comprising:
- a computing system each comprising one or more data processors;
- a cooling apparatus thermally coupled to the one or more data processors, the cooling apparatus configured to:
- receive fluid at an inlet manifold;
- direct the fluid from the inlet manifold to a lower portion of a vapor chamber that is in direct thermal contact with the one or more data processor;
- enable a convection flow of vapor from the lower portion of the vapor chamber to an upper portion of the vapor chamber;
- direct the fluid through a first heat exchanger thermally coupled to the lower portion of the vapor chamber;
- and
- direct the fluid through a second heat exchanger thermally coupled to the upper portion of the vapor chamber.
5 more elements
An assembly comprising:
- an integrated circuit comprising at least one central processing unit and a plurality of graphics processing units;
- a cooling apparatus in thermal contact with the integrated circuit, the cooling apparatus comprising:
- a vapor chamber comprising a plurality of portions, each portion comprising a cooling surface;
- at least one conduit for vapor convection and fluid return between the portions;
- and
- wherein the cooling surface of each portion comprises a heat exchanger.
3 more elements
An apparatus for cooling integrated circuits, the apparatus comprising:
- a vapor chamber comprising an upper portion and a lower portion, each portion comprising a cooling surface;
- a conduit for vapor convection and fluid return between the upper portion and the lower portion;
- and
- each cooling surface comprising an arrangement of metallic fins.
1 more element
Dependencies are inferred from the claim text.